admin(PRWEB) October 27, 2011
Memphis is pleased to announce the launch of its latest high density 2Gb DDR2 components, double IC. 2 GB of DDR2 dual-Memphis will be in the package configuration and x8 FBGA package of 63 (DDP), the last of Memphis IC is limited board space and limitations of the 14 address lines (A0-A13) especially attractive in applications. Memphis also will use its VLP Mini-DIMM and SO-RDIMM memory chip is a compact industrial PC and network applicationsTechnically, the Memphis
2 GB dual-chip package (DDP), as the. Independent of 1 Gbit DDR2 DRAM processing, use of space of two is only a chip on the motherboard DDR2 FBGA regularly pack of 60 compared to a monolithic integrated circuit, two 3-chip additional signal to control BGA the chip select, the ODT and clock enable connection of the second
Meanwhile, Memphis is ready to 4GB of dual DDR2 memory chips, expected to be released in the fourth quarter, 2011th to use a dual 2Gb IC 63 in the same FBGA packages, the IC is used in a package only 4 GB DDR2 2GB Memphis two
With the release of 2 GB and 4 GB of DDR2 dual
product line of DDR2 memory, Memphis to meet the requirements of the high density of industrial computing market, embedded, from the monolithic 2GB DDR2 DRAM (X4, X8, X16), 2 GB or 4 GB of DDR2 dual row (X8).
Memphis
high-density DDR2 products in industrial temperature specifications.
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